Electronics Recovery Service: Solutions for BGA Rework and BGA Repair    
  ERS approaches each Area-Array (BGA, uBGA, QFN, Flip-Chip) job emphasizing:

                            Quality, On-Time Delivery and Value

Quality:   1000's of BGA replaced and dozens of major Contract Manufacturers/OEM's trained by Electronics Recovery Service.

On-Time Delivery:   Standard delivery is 5 business days after receipt of all documentation and materials.  No expedite fee for 1 week turns!

Value:   Typical BGA replacements start at $75.00 ea... including setup and profile development!

BGA Replacement Process:
Bake-out moisture sensitive components.
Masking adjacent/secondary side heat sensitive
components.
Custom thermal profile development.
Monitored removal to profile.
Pad preparation and mask touch-up as required.
Addition of Solder paste and/or Flux
Split-beam x, y, theta placement.
Monitored reflow.
Endoscopic Inspection.
X-ray Inspection.

                                                 NEW!
                   In-House laser cut stencil design/mfg. capability!
                                                                       
                     
     Detailed Documentation of BGA Rework performed

      Printed X-Ray of each reworked component included with order.
      Digitally captured X-Ray and endoscopic results available.
      Review of Board layout/land geometry with suggestions for changes if needed.

 Electronics Recovery Service   uses the following IPC Standards      
        IPC-7711/21 Rework and Repair
        IPC-A-610 Workmanship Standards
        IPC TM-650 Test Methods
        IPC-A-600 Acceptability of Printed Circuit Boards

  We make sure the customer returns... and the product doesn't!
    Lead Free BGA Rework, Lead Free BGA Repair, Sn-Pb Solder BGA Rework, Sn-Pb Solder BGA Repair